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[IEEE 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2019.4.22-2019.4.25)] 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Low temperature junctionless device stacking enabled by leading edge sequential 3D integration
Besnard, Guillaume, Gaudin, Gweltaz, Schwarzenbach, Walter, Ecarnot, Ludovic, Radu, Ionut, Nguyen, Bich-Yen, Vandooren, Anne, Collaert, NadineYear:
2019
Language:
english
DOI:
10.1109/VLSI-TSA.2019.8804665
File:
PDF, 651 KB
english, 2019