[IEEE 2019 International Symposium on VLSI Technology,...

  • Main
  • [IEEE 2019 International Symposium on...

[IEEE 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2019.4.22-2019.4.25)] 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Low temperature junctionless device stacking enabled by leading edge sequential 3D integration

Besnard, Guillaume, Gaudin, Gweltaz, Schwarzenbach, Walter, Ecarnot, Ludovic, Radu, Ionut, Nguyen, Bich-Yen, Vandooren, Anne, Collaert, Nadine
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2019
Language:
english
DOI:
10.1109/VLSI-TSA.2019.8804665
File:
PDF, 651 KB
english, 2019
Conversion to is in progress
Conversion to is failed