Investigation on the crack fracture mode and edge quality...

Journal of Materials Processing Technology 2020 / 01 Vol. 275

Investigation on the crack fracture mode and edge quality in laser dicing of glass-anisotropic silicon double-layer wafer

Zhao, Chunyang, Cai, Yecheng, Ding, Ye, Yang, Lijun, Wang, Zhenlong, Wang, Yang
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Volume:
275
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2019.116356
Date:
January, 2020
File:
PDF, 10.79 MB
english, 2020
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