Room temperature creep mechanism of a Pb-Sn-Sb lead alloy

Procedia Structural Integrity 2019 Vol. 18

Room temperature creep mechanism of a Pb-Sn-Sb lead alloy

Viespoli, Luigi Mario, Johanson, Audun, Alvaro, Antonio, Nyhus, Bård, Berto, Filippo
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Volume:
18
Year:
2019
Language:
english
Journal:
Procedia Structural Integrity
DOI:
10.1016/j.prostr.2019.08.142
File:
PDF, 849 KB
english, 2019
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