Residual stress measurement through the thickness of ball grid array microelectronics packages using incremental hole drilling
Hosseini, S.M., Akbari, S., Shokrieh, M.M.Volume:
102
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113473
Date:
November, 2019
File:
PDF, 3.12 MB
english, 2019