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A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles
Matallana, A., Robles, E., Ibarra, E., Andreu, J., Delmonte, N., Cova, P.Volume:
102
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113500
Date:
November, 2019
File:
PDF, 2.95 MB
english, 2019