Thermal Performance of 3D IC Package with Embedded TSVs

Transactions of The Japan Institute of Electronics Packaging 2012 Vol. 5; Iss. 1

Thermal Performance of 3D IC Package with Embedded TSVs

Tain, Ra-Min, Dai, Ming-Ji, Chao, Yu-Lin, Li, Sheng-Liang, Chien, Heng-Chieh, Wu, Sheng-Tsai, Li, Wei, Lo, Wei-Chung
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Volume:
5
Year:
2012
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.5.75
File:
PDF, 2.90 MB
english, 2012
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