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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - High Density Ultra-Thin Organic Substrates for Advanced Flip Chip Packages
Islam, Nokibul, Tan, KH, Yoon, Seung Wook, Chen, TonyYear:
2019
DOI:
10.1109/ECTC.2019.00056
File:
PDF, 537 KB
2019