[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages
Kim, Young-Ja, Hah, Jinho, Moon, Kyoung-Sik, Wong, C. P.Year:
2019
DOI:
10.1109/ECTC.2019.00325
File:
PDF, 742 KB
2019