Microstructure and bonding performance of an Au-coated Ag alloy wire
Zhou, Wenyan, Chen, Jialin, Pei, Hongying, Kang, Feifei, Wu, Yongjin, Kong, Jianwen, Yang, Guoxiang, Yi, JianhongVolume:
217
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2019.111104
Date:
September, 2019
File:
PDF, 2.24 MB
2019