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The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration
Qiu, Hongyu, Hu, Xiaowu, Jiang, Xiongxin, Li, QinglinVolume:
256
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2019.126609
Date:
December, 2019
File:
PDF, 2.89 MB
english, 2019