Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
Lanzillo, N.A., Yang, C.-C., Motoyama, K., Huang, H., Cheng, K., Maniscalco, J., van Der Straten, O., Penny, C., Standaert, T., Choi, K.Year:
2019
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/LED.2019.2940869
File:
PDF, 471 KB
english, 2019