[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Where is the Sweet Spot for Panel Level Packaging?
Braun, T, Becker, K. -F., Hoelck, O., Voges, S., Woehrmann, M., Boettcher, L., Toepper, M., Stobbe, L., Aschenbrenner, R., Schneider-Ramelow, M., Lang, K. -D.Year:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735124
File:
PDF, 167 KB
english, 2019