Experimental study on heat sink with porous copper as...

Experimental study on heat sink with porous copper as conductive material for CPU cooling

Zhang, Yin, Long, Enshen, Zhang, Mingshan
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Volume:
5
Year:
2018
Language:
english
Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2018.04.046
File:
PDF, 711 KB
english, 2018
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