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Effective and combined stressors from multi-dimensional mission profiles for semiconductor reliability
Hirler, A., Alsioufy, A., Biba, J., Lehndorff, T., Lochner, H., Simon, S., Sulima, T., Thomas, W., Hansch, W.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.06.015
Date:
September, 2019
File:
PDF, 1.37 MB
english, 2019