CHIP-PACKAGE CO-DESIGN FOR OPTIMIZATION OF 5.8 GHZ LNA...

Progress In Electromagnetics Research M 2018 Vol. 71

CHIP-PACKAGE CO-DESIGN FOR OPTIMIZATION OF 5.8 GHZ LNA PERFORMANCE BASED ON EMBEDDED INDUCTORS

Sun, Haiyan, Sun, Wenjun, Sun, Ling, Zhao, Jicong, Peng, Yihong, Fang, Jiaen, Miao, Xiaoyong, Wang, Honghui
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Volume:
71
Year:
2018
Language:
english
Journal:
Progress In Electromagnetics Research M
DOI:
10.2528/PIERM18051403
File:
PDF, 416 KB
english, 2018
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