Effect of Thermal Shock Process on the Microstructure and...

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Journal of the Air & Waste Management Association (1995-) 2019 / 09

Effect of Thermal Shock Process on the Microstructure and Peel Resistance of Single Sided Copper Clad Laminates Used in Waste Printed Circuit Boards

Liu, Fangfang, Wan, Bingbing, Wang, Fazhan, Chen, Weiping
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Language:
english
Journal:
Journal of the Air & Waste Management Association
DOI:
10.1080/10962247.2019.1674751
Date:
September, 2019
File:
PDF, 3.33 MB
english, 2019
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