Surface treatment of Cu nanowires using hydroxy acids to form oxide-free Cu junctions for high-performance transparent conductive films
Yokoyama, Shun, Kimura, Honoka, Oikawa, Hiroki, Motomiya, Kenichi, Jeyadevan, Balachandran, Takahashi, HideyukiVolume:
583
Language:
english
Journal:
Colloids and Surfaces A: Physicochemical and Engineering Aspects
DOI:
10.1016/j.colsurfa.2019.123939
Date:
December, 2019
File:
PDF, 2.83 MB
english, 2019