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Application of Paraffin Based Nanocomposite in Heat Pipe Module for Electronic Equipment Cooling
Chougule, Sandesh S., Nirgude, Vishal V., Shewale, Sapana P., Pise, Ashok T., Sahu, S.K., Shah, HardikVolume:
5
Year:
2018
Language:
english
Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2018.11.070
File:
PDF, 939 KB
english, 2018