3D Printer-Based Encapsulated Origami Electronics for...

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ACS Nano 2019 / 10

3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Jo, Mansik, Bae, Seunghwan, Oh, Injong, Jeong, Ji-hun, Kang, Byungsoo, Hwang, Seok Joon, Lee, Seung S., Son, Hae Jung, Moon, Byung-Moo, Ko, Min Jae, Lee, Phillip
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Language:
english
Journal:
ACS Nano
DOI:
10.1021/acsnano.9b02362
Date:
October, 2019
File:
PDF, 1.76 MB
english, 2019
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