Electrical, Thermal and Mechanical Characterization of eWLB, Fully-Molded Fan-Out Package and Fan-Out Chip Last Package
Shih, Meng-Kai, Huang, Chih-Yi, Chen, Tsan-Hsien, Wang, Chen-Chao, Tarng, David, Hung, CPYear:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2019.2935477
File:
PDF, 280 KB
english, 2019