Aluminum metallization and wire bonding aging in power...

Materials Today: Proceedings 2018 Vol. 5; Iss. 6

Aluminum metallization and wire bonding aging in power MOSFET modules

Ruffilli, R., Berkani, M., Dupuy, P., Lefebvre, S., Weber, Y., Warot-Fonrose, B., Marcelot, C., Legros, M.
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Volume:
5
Year:
2018
Language:
english
Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2018.03.056
File:
PDF, 2.21 MB
english, 2018
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