A new unified constitutive model for SAC305 solder under...

A new unified constitutive model for SAC305 solder under thermo-mechanical loading

Chen, Gang, Hu, Tao, Xie, Mingwei, Yang, Jing, Xu, Weiling
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Volume:
138
Language:
english
Journal:
Mechanics of Materials
DOI:
10.1016/j.mechmat.2019.103170
Date:
November, 2019
File:
PDF, 5.31 MB
english, 2019
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