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[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Power & Ground Bridging Trace Design for Improved Power Integrity
Lin, Hank, Tseng, Bin-Chyi, Yen, JacksonYear:
2019
Language:
english
DOI:
10.1109/ISEMC.2019.8825278
File:
PDF, 315 KB
english, 2019