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Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
TUNTHAWIROON, Phacharaphon, KANLAYASIRI, KannachaiVolume:
29
Language:
english
Journal:
Transactions of Nonferrous Metals Society of China
DOI:
10.1016/S1003-6326(19)65076-4
Date:
August, 2019
File:
PDF, 1.99 MB
english, 2019