Fatigue reliability design for metal dual inline packages...

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Microelectronics Reliability 2019 / 9

Fatigue reliability design for metal dual inline packages under random vibration based on response surface method

Su, Yutai, Fu, Guicui, Wan, Bo, Yu, Ting, Zhou, Wenqiang, Wang, Xu
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113404
Date:
September, 2019
File:
PDF, 2.19 MB
english, 2019
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