Atomistic Insights into Cu Chemical Mechanical Polishing...

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The Journal of Physical Chemistry C 2019 / 10

Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations

Wen, Jialin, Ma, Tianbao, Zhang, Weiwei, van Duin, Adri C.T., van Duin, Diana M., Hu, Yuanzhong, Lu, Xinchun
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Language:
english
Journal:
The Journal of Physical Chemistry C
DOI:
10.1021/acs.jpcc.9b08466
Date:
October, 2019
File:
PDF, 6.83 MB
english, 2019
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