Air Jet Impingement Cooling of Electronic Devices Using...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Kwon, Beomjin, Foulkes, Thomas, Yang, Tianyu, Miljkovic, Nenad, King, William P.
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2019.2936852
File:
PDF, 2.75 MB
english, 2019
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