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High-quality as-is 3D thermal modeling in MEP systems using a deep convolutional network
Son, Hyojoo, Kim, Changwan, Choi, HyunchulVolume:
42
Language:
english
Journal:
Advanced Engineering Informatics
DOI:
10.1016/j.aei.2019.100999
Date:
October, 2019
File:
PDF, 8.06 MB
english, 2019