A molecular dynamics study on heat conduction of...

Computational Materials Science 2020 / 02 Vol. 172

A molecular dynamics study on heat conduction of crosslinked epoxy resin based thermal interface materials for thermal management

Liu, Xinjian, Rao, Zhonghao
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
172
Language:
english
Journal:
Computational Materials Science
DOI:
10.1016/j.commatsci.2019.109298
Date:
February, 2020
File:
PDF, 3.71 MB
english, 2020
Conversion to is in progress
Conversion to is failed