![](/img/cover-not-exists.png)
Selective Electrophoretically Deposited Coatings as an Alternative to Tin and Tin/Lead Metallic Etch Resists
Merricks, DavidVolume:
72
Journal:
Transactions of the IMF
DOI:
10.1080/00202967.1994.11871015
Date:
January, 1994
File:
PDF, 2.21 MB
1994