Microstructure and shear property of In-Sn-xAg solder...

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Journal of Materials Science: Materials in Electronics 2019 / 9

Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding

Yang, Li, Xiong, Yifeng, Zhang, Yaocheng, Jiang, Wei, Wei, Di
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Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-02175-2
Date:
September, 2019
File:
PDF, 2.29 MB
2019
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