Acoustic analysis of ultrasonic assisted soldering for enhanced adhesion
Maassen, Ken F., Brown, Jennifer Shaffer, Choi, Hongseok, Thompson, Lonny L., Bostwick, Joshua B.Volume:
101
Journal:
Ultrasonics
DOI:
10.1016/j.ultras.2019.106003
Date:
February, 2020
File:
PDF, 2.71 MB
2020