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Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips
Li, Ji, Lv, Lucang, Zhou, Guohui, Li, XingpingVolume:
201
Language:
english
Journal:
Energy Conversion and Management
DOI:
10.1016/j.enconman.2019.112202
Date:
December, 2019
File:
PDF, 8.65 MB
english, 2019