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[ACM Press the 56th Annual Design Automation Conference 2019 - Las Vegas, NV, USA (2019.06.02-2019.06.06)] Proceedings of the 56th Annual Design Automation Conference 2019 on - DAC '19 - Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse
Kim, Jinwoo, Lee, Minah, Torun, Hakki Mert, Roy, Kallol, Swaminathan, Madhavan, Mukhopadhyay, Saibal, Krishna, Tushar, Lim, Sung Kyu, Murali, Gauthaman, Park, Heechun, Qin, Eric, Kwon, Hyoukjun, ChaitYear:
2019
Language:
english
DOI:
10.1145/3316781.3317775
File:
PDF, 4.13 MB
english, 2019