A novel intercooled series expansion refrigeration/liquefaction cycle using pinch technology
Lei, Gang, Yu, Jianrong, Kang, Huifang, Li, Qing, Zheng, Hongfei, Wang, Tianxiang, Yang, Lufeng, Xuan, ZhiyongVolume:
163
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2019.114336
Date:
December, 2019
File:
PDF, 2.72 MB
2019