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Optical via for silicon photonic 3D-integrations

Optical via for silicon photonic 3D-integrations

Lin, Tianhua, Han, Qin, Chu, Tao
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Volume:
452
Journal:
Optics Communications
DOI:
10.1016/j.optcom.2019.07.031
Date:
December, 2019
File:
PDF, 971 KB
2019
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