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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Product Level Design Optimization for 2.5D Package Pad Cratering Reliability During Drop Impact
Wang, Huayan, Wang, Jing, Xu, Jiefeng, Pham, Vanlai, Pan, Ke, Park, Seungbae, Lee, Hohyung, Refai-Ahmed, GamalYear:
2019
DOI:
10.1109/ectc.2019.00323
File:
PDF, 689 KB
2019