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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Cu-Cu Bonding by Low-Temperature Sintering of Self-Healable Cu Nanoparticles
Li, Junjie, Liang, Qi, Chen, Chen, Shi, Tielin, Liao, Guanglan, Tang, ZirongYear:
2019
DOI:
10.1109/ECTC.2019.00105
File:
PDF, 591 KB
2019