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[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Embedded Component Packaging for Wafer-Level Encapsulated and Integrated RF Mems
Hadizadeh, Rameen, Laitinen, Anssi, Molinero, David, Cunningham, Shawn, Vockerberger, Christian, Weis, GeraldYear:
2019
DOI:
10.1109/TRANSDUCERS.2019.8808808
File:
PDF, 890 KB
2019