[IEEE 2019 IEEE 69th Electronic Components and Technology...

  • Main
  • [IEEE 2019 IEEE 69th Electronic...

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Reliability of Laminated Bond Structure Using (Cu, Ni)/Sn TLP Bonding with Al Interlayer for High Temperature Power Electronics Packaging

Liu, Yanghe, Joshi, Shailesh N., Dede, Ercan M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2019
DOI:
10.1109/ectc.2019.00221
File:
PDF, 744 KB
2019
Conversion to is in progress
Conversion to is failed