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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Reliability of Laminated Bond Structure Using (Cu, Ni)/Sn TLP Bonding with Al Interlayer for High Temperature Power Electronics Packaging
Liu, Yanghe, Joshi, Shailesh N., Dede, Ercan M.Year:
2019
DOI:
10.1109/ectc.2019.00221
File:
PDF, 744 KB
2019