[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes
Busek, David, Dusek, Karel, Beran, Tomas, Vesely, PetrYear:
2019
Language:
english
DOI:
10.1109/ISSE.2019.8810299
File:
PDF, 584 KB
english, 2019