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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Analysis of Forces during UV Glue Curing for Micro-Assembly Applications
Tiwari, Bhawnath, Clevy, Cedric, Lutz, PhilippeYear:
2019
Language:
english
DOI:
10.1109/dtip.2019.8752841
File:
PDF, 749 KB
english, 2019