[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle
Jani, Imed, Lattard, Didier, Vivet, Pascal, Arnaud, Lucile, Cheramy, Severine, Beigne, Edith, Farcy, Alexis, Jourdon, Joris, Henrion, Yann, Deloffre, Emilie, Bilgen, HalimYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00272
File:
PDF, 649 KB
english, 2019