[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - An Integer Programming Application for PCB Stack-up Arrangement
He, Jiayi, Klivans, Adam, Kiguradze, Zurab, Chada, Arun, Mutnury, Bhyrav, Reddy, Jay, Drewniak, James, Fan, JunYear:
2019
Language:
english
DOI:
10.1109/isemc.2019.8825215
File:
PDF, 314 KB
english, 2019