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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Thermal Cycling Simulation and Sensitivity Analysis of Wafer Level Chip Scale Package with Integration of Metal-Insulator-Metal Capacitors
Zhou, Yi, Chen, Liangbiao, Liu, Yong, Sitaraman, SureshYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00234
File:
PDF, 1.25 MB
english, 2019