[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Wafer Level Integration of Thin Silicon Bare Dies Within Flexible Label
Souriau, Jean-Charles, Itawi, Ahmad, Castagne, LaetitiaYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00242
File:
PDF, 711 KB
english, 2019