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[IEEE 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Montreal, QC, Canada (2019.5.26-2019.5.26)] 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - How (not ) to Remove Technical Debt in Testing Environments
Guerlesquin, ValentinYear:
2019
DOI:
10.1109/techdebt.2019.00008
File:
PDF, 110 KB
2019