Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application
Seo, Hankyeol, Park, Hae Sung, Kim, Sarah EunkyungVolume:
9
Language:
english
Journal:
Applied Sciences
DOI:
10.3390/app9173535
Date:
August, 2019
File:
PDF, 5.24 MB
english, 2019