ULSI Wiring Formation by Copper Electroplating in the...

Electrochemistry 2001 / 10 Vol. 69; Iss. 10

ULSI Wiring Formation by Copper Electroplating in the Presence of Additives

MIURA, Shuhei, OYAMADA, Kimiko, TAKADA, Yuichi, HONMA, Hideo
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Volume:
69
Language:
english
Journal:
Electrochemistry
DOI:
10.5796/electrochemistry.69.773
Date:
October, 2001
File:
PDF, 292 KB
english, 2001
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