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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging
Son, Kirak, Kim, Gahui, Ryu, Hyodong, Park, Gyu-Tae, Son, Ho-Young, Kim, Nam-Seog, Yang, Cheol-Woong, Kim, Young-Cheon, Han, Jeong Sam, Park, Young-BaeYear:
2019
Language:
english
DOI:
10.1109/ECTC.2019.00-10
File:
PDF, 619 KB
english, 2019